A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging. This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices. The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal designs as well as materials, processes, manufacturing, testing, and reliability. Among the topics explored:
Procurando Advanced MEMS Packaging (English Edition)? Aqui você encontra tudo sobre este livro de John H. Lau, publicado por International Marine/Ragged Mountain Press em 22 de outubro de 2009. Nesta página estão a descrição da obra, os detalhes da edição e os formatos disponíveis para baixar: pdf, epub, txt, djvu. Se você gosta de Livros Internacionais, Engenharia e Transporte, Engenharia, Elétrica e Eletrônica, Eletrônica, Microeletrônica, explore também outros títulos da mesma categoria no Encontrando os melhores livros. Veja ainda as outras obras de John H. Lau em nosso catálogo.
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