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Descrição do livro

Master the Hidden Physics Driving Modern Semiconductor Manufacturing

In the sub-2nm gate-all-around (GAA) and 300+ layer 3D NAND era, thin-film deposition equipment must deliver atomic-scale thickness control, perfect step coverage over high-aspect-ratio structures, and tailored material properties. Product Engineering for Semiconductor Deposition Equipment & Processes bridges the gap between fundamental physical chemistry, plasma physics, hardware architecture, and yield engineering. Designed as a 15-week, 30-topic advanced engineering guide, this work equips engineers to design, optimize, and troubleshoot commercial deposition cluster platforms.

Inside, You’ll Master:

  • Deposition Physics & Transport Dynamics: Formulate kinetic equations for gas-phase diffusion, Knudsen flow regimes, boundary layer dynamics, and thermal surface reaction rates.
  • Reactor & Subsystem Hardware Engineering: Analyze mechanical tradeoffs of vacuum cluster tools, electrostatic chuck (ESC) clamping physics, multi-zone resistive heating, and mass flow controller (MFC) fluidics.
  • Advanced Thin-Film Technologies: Optimize PVD magnetrons, HiPIMS, PEALD, MOCVD, epitaxial SiGe growth, and selective-area deposition (ASD) strategies.
  • Diagnostics & Yield Optimization: Utilize Optical Emission Spectroscopy (OES), Spectroscopic Ellipsometry (SE), and Residual Gas Analyzers (RGA) for real-time fault detection and classification (FDC).
  • Product Lifecycle & HVM Scaling: Execute Phase-Gate product development, enforce strict Copy-Exact (CE) protocols, and model Cost of Ownership (CoO) and Mean Time Between Failures (MTBF).

Packed with real-world industrial case studies, multi-physics simulations, and worked mathematical derivations, this volume is an essential reference for product engineers, process integration leads, and equipment designers driving the future of semiconductor manufacturing.

Encadernação Product Engineering for Semiconductor Deposition Equipment & Processes (English Edition):Kindle